NDLI: Wire-bonding process monitoring using thermopile temperature sensor

Content Provider	IEEE Xplore Digital Library
Author	Suman, S. Gaitan, M. Joshi, Y. Harman, G.G.
Copyright Year	1999
Abstract	This work presents an approach to separate the thermal response due to ultrasonic excitation and ball deformation through novel application of aluminum-polysilicon thermopile sensors under the bond pad. These integrated thermopile sensors measure temperature at a radial distance under the bond pad, in contrast to the previously reported average measurements over the bond pad interface or around the bond pad over a radial distance. The high sensitivity and signal-to-noise ratio (SNR) of the sensor allow direct measurements of the signal, without any amplification or filtration. Transient temperature variations at two radial locations were obtained using two versions of thermopile sensor designs. The sensor response was interpreted using representative finite-element thermal modeling for the process. Results from modeling reveal that the thermal response is a strong function of radial location. These results also reveal that the thermal response due to interfacial heating is significantly higher under the bond pad, as compared to that around the bond pad. This is in agreement with the experimental observations. Critical points on the temperature variation curve were identified. These points can be used to correlate the sensor response to shear test data. Once the sensor response is calibrated, it can be used to monitor the bonding process. Measurements were performed at substrate temperatures of 150/spl deg/C and 200/spl deg/C, along with the microwelds characterization at the bonding interface. The comparison of the thermal response and the microwelds at the two substrate temperatures revealed that in order to correlate the sensor response to shear test data, the response must be obtained at the intended temperature of operation since the microwelds at two temperatures may be quite different, even though thermal responses may look similar.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	685
Ending Page	693
Page Count	9
File Size	1237701
File Format	PDF
ISSN	15213323
Volume Number	28
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-11-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature sensors Temperature measurement Bonding Thermal sensors Sensor phenomena and characterization Ultrasonic variables measurement Testing Signal to noise ratio Filtration Finite element methods thermosonic ball bonding CMOS compatible microelectromechanical system (MEMS) in situ process monitoring Seebeck effect thermopile temperature sensor
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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