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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kedzierski, J. Boyd, D. Cabral Jr., C. Ronsheim, P. Zafar, S. Kozlowski, P.M. Ott, J.A. Meikei Ieong |
| Copyright Year | 1963 |
| Abstract | Complete gate silicidation has recently been demonstrated as an excellent technique for the integration of metal gates into MOSFETs. From the various silicide gate materials NiSi has been shown to be the most scalable. In this paper, a versatile method for controlling the workfunction of an NiSi gate is presented. This method relies on doping the poly-Si with various impurities prior to silicidation. The effect of various impurities including B, P, As, Sb, In, and Al is described. The segregation of the impurities from the poly-Si to the silicide interface during the silicidation step is found to cause the NiSi workfunction shift. The effect of the segregated impurities on gate capacitance, mobility, local workfunction stability, and adhesion is studied. |
| Sponsorship | IEEE Electron Devices Society |
| Starting Page | 39 |
| Ending Page | 46 |
| Page Count | 8 |
| File Size | 918178 |
| File Format | |
| ISSN | 00189383 |
| Volume Number | 52 |
| Issue Number | 1 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-01-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | MOSFETs Semiconductor device doping Impurities Voltage control Nickel compounds workfunction engineering Dual silicidation full silicidation (FUSI) gate workfunction metal gate mid-gap gate NiSi silicidation-induced impurity segregation (SIIS) silicide gate thin body threshold voltage transistor scaling ultrathin body undoped body |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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