NDLI: Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

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Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

Content Provider	IEEE Xplore Digital Library
Author	Chunyan Yin Hua Lu Bailey, C. Yan-Cheong Chan
Copyright Year	1999
Abstract	This work describes the work of an investigation of the effects of solder reflow process on the reliability of anisotropic conductive film (ACF) interconnection for flip-chip on flex (FCOF) applications. Experiments as well as computer modeling methods have been used. The results show that the contact resistance of ACF interconnections increases after the reflow and the magnitude of the increase is strongly correlated to the peak reflow temperature. In fact, nearly 40 percent of the joints are open when the peak reflow temperature is 260/spl deg/C, while there is no opening when the peak temperature is 210/spl deg/C. It is believed that the coefficient of thermal expansion (CTE) mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. To understand this phenomenon better, a three-dimensional (3-D) finite element (FE) model of an ACF joint has been analyzed in order to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process. The stress level at the interface between the particle and its surrounding materials is significant and it is the highest at the interface between the particle and the adhesive matrix.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	254
Ending Page	259
Page Count	6
File Size	1725915
File Format	PDF
ISSN	1521334X
Volume Number	27
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-10-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Anisotropic magnetoresistance Conductive adhesives Temperature Semiconductor device modeling Anisotropic conductive films Application software Contact resistance Thermal expansion Polymers Thermal degradation reliability Anisotropic conductive film (ACF) computer modeling finite element (FE) reflow
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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