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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Er-Ping Li En-Xiao Liu Le-Wei Li Mook-Seng Leong |
| Copyright Year | 1999 |
| Abstract | This paper presents an accurate and systematic approach for analysis of the signal integrity of the high-speed interconnects, which couples the full-wave finite difference time domain (FDTD) method with scattering (S) parameter based macromodeling by using rational function approximation and the circuit simulator. Firstly, the full-wave FDTD method is applied to characterize the interconnect subsystems, which is dedicated to extract the S parameters of the subnetwork consisting of interconnects with fairly complex geometry. Once the frequency-domain discrete data of the S parameters of the interconnect subnetwork is constructed, the rational function approximation is carried out to establish the macromodel of the interconnect subnetwork by employing the vector fitting method, which provides a more robust and accurate solution for the overall problem. Finally, the analysis of the signal integrity of the hybrid circuit can be fulfilled by using the S parameters based macromodel synthesis and simulation program with integrated circuits emphasis (SPICE) circuit simulator. Numerical experiments demonstrate that the proposed approach is accurate and efficient to address the hybrid electromagnetic (interconnect part) and circuit problems, in which the electromagnetic field effects are fully considered and the strength of SPICE circuit simulator is also exploited. |
| Sponsorship | IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society |
| Starting Page | 213 |
| Ending Page | 223 |
| Page Count | 11 |
| File Size | 418612 |
| File Format | |
| ISSN | 15213323 |
| Volume Number | 27 |
| Issue Number | 1 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2004-02-01 |
| Publisher Place | U.S.A. |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Coupling circuits Time domain analysis Circuit simulation Signal analysis Integrated circuit interconnections Scattering parameters Finite difference methods SPICE Function approximation Analytical models |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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