NDLI: PCB integrated inductors for low power DC/DC converter

Content Provider	IEEE Xplore Digital Library
Author	Ludwig, M. Duffy, M. O'Donnell, T. McCloskey, P. Mathuna, S.C.O.
Copyright Year	1986
Abstract	This paper discusses the use of printed circuit board (PCB) integrated inductors for low power DC/DC buck converters. Coreless, magnetic plates and closed core structures are compared in terms of achievable inductance, power handling and efficiency in a footprint of 10 /spl times/ 10 mm/sup 2/. The magnetic layers consist of electroplated NiFe, so that the process is fully compatible with standard PCB process. Analytic and finite element method (FEM) methods are applied to predict inductor performance for typical current waveforms encountered in a buck converter. Conventional magnetic design procedures are applied to define optimum winding and core structures for typical inductor specifications. A 4.7 /spl mu/H PCB integrated inductor with dc current handling of up to 500 mA is presented. This inductor is employed in a 1.5 W buck converter using a commercial control integrated circuit (IC). The footprint of the entire converter measures 10 /spl times/ 10 mm/sup 2/ and is built on top of the integrated inductor to demonstrate the concept of integrated passives in power electronic circuits to achieve ultra flat and compact converter solutions.
Sponsorship	IEEE Power Electronics Society
Starting Page	937
Ending Page	945
Page Count	9
File Size	1122339
File Format	PDF
ISSN	08858993
Volume Number	18
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-07-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Inductors DC-DC power converters Buck converters Magnetic cores Printed circuits Inductance Magnetic analysis Performance analysis Finite element methods Power measurement
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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