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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hsin-Tang Chien Da-Sheng Lee Pei-Pei Ding Shiu-Lin Chiu Ping-Hei Chen |
| Copyright Year | 1999 |
| Abstract | A mounting base integrated with disk-shaped miniature heat pipe (DMHP) is designed for laser diode TO can package in the present study. The heat spreading performance of the disk-shaped miniature heat pipe is also presented. The present mounting base is made of aluminum (6061 T6) other than the conventional TO can package with oxygen free copper. The mounting base shows different thermal resistance with different working fluid charge volume. By optimizing the working fluid charge volume, the thermal resistance of the present mounting base will become lower than the conventional base with an oxygen free copper disk for TO can package. Moreover, this novel design can be manufactured on a massive scale and the fabrication cost can thus be effectively reduced. |
| Sponsorship | IEEE Components, Packaging, and Manufacturing Technology Society |
| Starting Page | 569 |
| Ending Page | 574 |
| Page Count | 6 |
| File Size | 545186 |
| File Format | |
| ISSN | 15213331 |
| Volume Number | 26 |
| Issue Number | 3 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-09-01 |
| Publisher Place | U.S.A. |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Diode lasers Copper Semiconductor diodes Thermal resistance Semiconductor lasers Temperature Laser modes Electronic packaging thermal management Semiconductor device packaging Costs |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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