NDLI: Elimination of stress-induced curvature in thin-film structures

Content Provider	IEEE Xplore Digital Library
Author	Bifano, T.G. Johnson, H.T. Bierden, P. Mali, R.K.
Copyright Year	1992
Abstract	Argon ion machining of released thin-film devices is shown to alter the contour shape of free-standing thin-film structures by affecting their through-thickness stress distributions. In experiments conducted on MEMS thin-film mirrors it is demonstrated that post-release out-of-plane deformation of such structures can be reduced using this ion beam machining method. In doing so optically flat surfaces (curvature <0.001 mm/sup -1/) are achieved on a number of 3 /spl mu/m-thick surface micromachined silicon structures, including mirrors with either initially positive curvature or initially negative curvature measuring up to 0.02 mm/sup -1/. An analytical model incorporating the relevant mechanics of the problem is formulated and used to provide an understanding of the mechanisms behind the planarization process based on ion machining. The principal mechanisms identified are 1) amorphization of a thin surface layer due to ion beam exposure and 2) gradual removal of stressed material by continued exposure to the ion beam. Curvature history predictions based on these mechanisms compare well with experimental observations.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	592
Ending Page	597
Page Count	6
File Size	233605
File Format	PDF
ISSN	10577157
Volume Number	11
Issue Number	5
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-10-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transistors Machining Ion beams Thin film devices Mirrors Argon Shape Stress Micromechanical devices Particle beam optics
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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