NDLI: A novel approach for flip chip solder joint quality inspection: laser ultrasound and interferometric system

Content Provider	IEEE Xplore Digital Library
Author	Sheng Liu Erdahl, D. Ume, I.C. Achari, A. Gamalski, J.
Copyright Year	1999
Abstract	A novel, noncontact, nondestructive approach for flip chip solder joint quality inspection is presented. In this technique, a pulsed laser generates ultrasound on the chip's surface, exciting the whole chip into a vibration motion. An interferometer was used to measure the vibration displacement of the chip's surface. Because changes in solder joint quality produce a different vibration response, a value, "error ratio," is used to measure the difference between a good chip and a chip with defects. An automatic signal-processing algorithm to calculate the error ratio was developed and implemented, as well as a frequency analysis algorithm. The inspection system was characterized, and results are presented for two cases of flip chips with missing solder balls. Results indicate that a laser ultrasonic/interferometeric system offers great promise for solder bump inspection in flip chip, BGA, chip scale, and micro BGA packages.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	616
Ending Page	624
Page Count	9
File Size	457293
File Format	PDF
ISSN	15213331
Volume Number	24
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip solder joints Inspection Vibration measurement Optical pulse generation Semiconductor device measurement Ultrasonic variables measurement Flip chip Ultrasonic imaging Surface emitting lasers Displacement measurement
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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