NDLI: Crosstalk and interconnection distance considerations for board-to-board optical interconnects using 2-D VCSEL and microlens array

Content Provider	IEEE Xplore Digital Library
Author	Kim, G. Xuliang Han Chen, R.T.
Copyright Year	1989
Abstract	We describe the design and experimental characterization of a substrate-mode optical backplane using 0.5-, 0.75- and 1-mm spacing two-dimensional (2-D) optical beam arrays. The system uses arrays of multiplexed holograms to implement free space board-to-board interconnects, and employs 250-/spl mu/m pitch 2-D vertical-cavity surface-emitting lasers (VCSEL) and microlens array as a transmitter to provide 0.5- to 1-mm spacing 2-D beam array, operating at 850 nm. By comparing the optical beam properties at the detector plane including the spot size and power uniformity of the optical beam array, as well as signal-to-noise ratio (SNR), the maximum interconnect distances are justified. Furthermore, we point out the improvement of the throughput that can be achieved by 2D crosstalk analysis within the same design concept. The results of crosstalk analysis obtained here can be used for application to the standard five-board free-space optical backplane system.
Sponsorship	IEEE Lasers and Electro-Optics Society
Starting Page	743
Ending Page	745
Page Count	3
File Size	336286
File Format	PDF
ISSN	10411135
Volume Number	12
Issue Number	6
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Optical arrays Optical beams Optical transmitters Vertical cavity surface emitting lasers Optical crosstalk Optical interconnections Backplanes Power system interconnection Optical design Two dimensional displays
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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