NDLI: RF interconnect for multi-gbit/s board-level clock distribution

Content Provider	IEEE Xplore Digital Library
Author	Woonghwan Ryu Junwoo Lee Hyungsoo Kim Seungyoung Ahn Namhoon Kim Baekkyu Choi Donggun Kam Joungho Kim
Copyright Year	1999
Abstract	With clock distribution of over 1 GHz, problems associated with clock skew, power consumption, and timing jitter are becoming critical for determining the processing speed of high-performance digital systems, especially for multi-processor systems. Conventional digital clock distribution interconnection has a severe power consumption problem for GHz clock distribution because of the transmission line losses, as well as exhibiting difficult signal integrity problems due to clock skew, clerk jitter and signal reflection. To overcome conventional digital clock distribution limitations, optical clock distribution techniques, based on guided-wave optics and free-space optics, have been proposed. However, the optical clock distribution is found to be bulky, hard to fabricate, and expensive, even though it has lower power consumption and excellent signal integrity properties. In this paper, a multi-Gbit/s clock distribution scheme to minimize power consumption, skew, and jitter, based on RF interconnect technology, especially for the medium clock frequency region from 200 MHz to 10 GHz, and interconnection line lengths of from 10 cm to 3 m, is proposed. A quantitative comparison is made between the guided optical, the free-space optical, the conventional digital, and the proposed RF interconnections for board-level clock distribution relative to power consumption and speed. The proposed board-level clock distribution with 32-fan-outs has successfully demonstrated less than 22-ps skew and less than 3-ps jitter at 2 GHz. The estimated power consumption of the clock link for the proposed clock distribution has been shown to be about 320 mW. Furthermore, the proposed clock receiver using the RF clock distribution scheme has demonstrated less than 2-ps dead time and 3-ps skew time.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	398
Ending Page	407
Page Count	10
File Size	666137
File Format	PDF
ISSN	15213323
Volume Number	23
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency Clocks Energy consumption Optical receivers Optical interconnections Power system interconnection Timing jitter Digital systems Power transmission lines Optical losses
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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