NDLI: On enhancing eutectic solder joint reliability using a second-reflow-process approach

Please wait, while we are loading the content...

Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing

The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages

Characterization of interfacial adhesion damage induced by accelerated life testing

Reliability of thick Al wire bonds in IGBT modules for traction motor drives

Heat transfer from pin-fin heat sinks under multiple impinging jets

Correction to Die-cracking and reliable die design for flip-chip assemblies

Year : 1999 Volume : 22

On enhancing eutectic solder joint reliability using a second-reflow-process approach

Content Provider	IEEE Xplore Digital Library
Author	Kuo-Ning Chiang Yung-Te Lin Hsien-Chie Cheng
Copyright Year	1999
Abstract	A three-dimensional (3-D) solder liquid formation model is developed for predicting the geometry, the restoring force and the reliability of solder joints in an area array of interconnects [e.g., ball grid array (BGA), flip chip] with various pad configurations. In general, the restoring force and the reliability of the solder joints depend on the thermal-mechanical behavior of the solder, the geometry of the solder ball, and the geometry layout/material properties of the package. A good solder pad configuration could lead to a larger restoring force along the gravitational direction (a higher standoff height and a blunter contact angle) with better reliability characteristics achieved. In this research, a second-reflow-process approach is applied for the reliability enhancement of typical EGA assemblies, including PBGA and SuperBGA assemblies. The results show that for a typical PBGA assembly, the ratio of the enhancement by application of the second-reflow-process approach is 2.03 based on the Coffin-Manson criterion and 1.4 based on the energy density based method, and more significantly, for a typical SuperBGA assembly, it is 7.17 and 2.422, respectively.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	9
Ending Page	14
Page Count	6
File Size	407164
File Format	PDF
ISSN	15213323
Volume Number	23
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Assembly Geometry Thermal force Lead Solid modeling Predictive models Electronics packaging Flip chip Materials reliability
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Design, fabrication and comparison of lead-free/eutectic solder joint reliability of flip chip package

Reliability analysis and design for the fine-pitch flip chip BGA packaging

Optimization of design and manufacturing parameters for solder joint geometry and self-alignment in flip-chip technology

Reliability Analysis of Lead-free Flip Chip Solder Joint

Electromigration in Flip Chip Pb-Free Solder Joints

Solder reflow prediction of hybrid pad packaging system

Effect of Ar reflow atmosphere on the SAC305 solder joint reliability

Effect of Ar reflow atmosphere on the SAC305 solder joint reliability

An overview of solder bump shape prediction algorithms with validations

On enhancing eutectic solder joint reliability using a second-reflow-process approach

Similar Documents

Design, fabrication and comparison of lead-free/eutectic solder joint reliability of flip chip package

Reliability analysis and design for the fine-pitch flip chip BGA packaging

Optimization of design and manufacturing parameters for solder joint geometry and self-alignment in flip-chip technology

Reliability Analysis of Lead-free Flip Chip Solder Joint

Electromigration in Flip Chip Pb-Free Solder Joints

Solder reflow prediction of hybrid pad packaging system

Effect of Ar reflow atmosphere on the SAC305 solder joint reliability

Effect of Ar reflow atmosphere on the SAC305 solder joint reliability

An overview of solder bump shape prediction algorithms with validations

On enhancing eutectic solder joint reliability using a second-reflow-process approach