NDLI: Fast and efficient parametric modeling of contact-to-substrate coupling

Content Provider	IEEE Xplore Digital Library
Author	Masoumi, N. Elmasry, M.I. Safavi-Naeini, S.
Copyright Year	1982
Abstract	This paper presents two rapid and yet accurate modeling methods for substrate coupling between a device contact and a substrate backplane. We discuss effects of physical parameters and geometrical characteristics of the contact and the substrate on the proposed models. We also derive model expressions for extraction of circuit-model elements of the substrate. Both methods are efficient for speed, memory usage, and adaptable to computer-aided design (CAD) tools for optimization tasks. The accuracy of both methods, the parametric modeling method and the microstrip line approximation method, is validated by comparing with the rigorous simulation data obtained from IE3D. Using the new models, we record a much higher speedup factor and extremely lower memory requirements compared to other published methods. The modeling methods are extended to two-layer structures and the models are applied to spiral inductors for verification purposes. In our research, we have validated the models over a wide range of frequencies up to 20 GHz.
Sponsorship	IEEE Council on Electronic Design Automation IEEE Circuits and Systems Society
Starting Page	1282
Ending Page	1292
Page Count	11
File Size	384937
File Format	PDF
ISSN	02780070
Volume Number	19
Issue Number	11
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-11-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Parametric statistics Design automation Coupling circuits Backplanes Solid modeling Data mining Design optimization Microstrip Approximation methods Computational modeling
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Electrical and Electronic Engineering Software

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