NDLI: Fundamental characteristics of electrostatic wafer chuck with insulating sealant

Content Provider	IEEE Xplore Digital Library
Author	Yatsuzuka, K. Hatakeyama, F. Asano, K. Aonuma, S.
Copyright Year	1972
Abstract	The electrostatic wafer chuck is the most preferable handling method in advanced semiconductor manufacture. Even in a vacuum environment, it enables not only the ability to retain a wafer flat, but also to enhance heat transfer through the whole surface area because of firm contact. We have investigated the fundamental characteristics of an electrostatic chuck consisting of a pair of comb-type electrodes and a thin polymer film as a dielectric layer. In order to prevent breakdown between electrodes, the air gap between electrodes was filled with sealing material. The electrostatic force acting on the 4-inch silicon wafer is measured. Several types of insulating sealants and dielectric films were examined. The attractive force increased with the square of the applied voltage in the region of lower applied voltage and gradually saturated at higher voltage. The maximum force obtained in our experiments was approximately 30 N. These experimental results proved the high potentiality in actual use of the electrostatic chuck for silicon wafer handling. However, a few problems have to be overcome. Although the higher electrostatic force can be gained with the thinner dielectric layer, the thin polymer film is easily deformed and torn by tension when the object starts moving.
Sponsorship	IEEE Industry Applications Society
Starting Page	510
Ending Page	516
Page Count	7
File Size	187577
File Format	PDF
ISSN	00939994
Volume Number	36
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrostatics Electrodes Voltage Polymer films Dielectric films Sealing materials Force measurement Silicon Semiconductor device manufacture Heat transfer
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering

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