NDLI: Defect formation mechanisms in laser welding techniques for semiconductor laser packaging

Content Provider	IEEE Xplore Digital Library
Author	Wood-Hi Cheng Wei-Han Wang Jyh-Cheng Chen
Copyright Year	1994
Abstract	In this work, the authors experimentally investigate defect formation mechanisms in spot-welding techniques for semiconductor laser packaging. Results obtained from the stainless-to-stainless steel joints indicate that the dimension of hole formation depends on the laser power density, and the hole disappears as the power density is below 3/spl times/10/sup 5/ W/cm/sup 2/. In the stainless-to-Kovar/sup TM/ joints, surface cracks are eliminated by reducing the gold thickness from the Kovar/sup TM/ before welding, while the centerline cracks in the fusion zone are eliminated by the air gap tightness between the Kovar/sup TM/ and stainless steel. The excess laser energy is the possible cause for hole formation. The low solubility of gold in the Kovar/sup TM/ and the large air gap between the joints are the possible causes for surface cracks and enhancing centerline crack propagation, respectively. A technique for reduction of post weld shift (PWS) in semiconductor laser packaging is also presented. Preliminary reliability data demonstrated that these laser packages, which do not have hole and crack defects in the welded joints, are reliable.
Sponsorship	IEEE Computer Society
Starting Page	764
Ending Page	769
Page Count	6
File Size	1070143
File Format	PDF
ISSN	10709894
Volume Number	19
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-11-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Semiconductor lasers Welding Semiconductor device packaging Fiber lasers Gold Laser stability Optical materials Steel Costs Laser fusion
Content Type	Text
Resource Type	Article
Subject	Engineering

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