NDLI: Mechanical signature analysis using time-frequency signal processing: application to internal combustion engine knock detection

Content Provider	IEEE Xplore Digital Library
Author	Samimy, B. Rizzoni, G.
Copyright Year	1963
Abstract	Signature analysis consists of the extraction of information from measured signal patterns. The work presented in this paper illustrates the use of time-frequency (TF) analysis methods for the purpose of mechanical signature analysis. Mechanical signature analysis is a mature and developed field; however, TF analysis methods are relatively new to the field of mechanical signal processing, having mostly been developed in the present decade, and have not yet been applied to their full potential in this field of engineering applications. Some of the ongoing efforts are briefly reviewed in this paper. One important application of TF mechanical signature analysis is the diagnosis of faults in mechanical systems. In this paper we illustrate how the use of joint TF signal representations can result in tangible benefits when analyzing signatures generated by transient phenomena in mechanical systems, such as might be caused by faults or otherwise abnormal operation. This paper also explores signal detection concepts in the joint TF domain and presents their application to the detection of internal combustion engine knock.
Sponsorship	IEEE Publication
Starting Page	1330
Ending Page	1343
Page Count	14
File Size	1970077
File Format	PDF
ISSN	00189219
Volume Number	84
Issue Number	9
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Signal analysis Time frequency analysis Mechanical systems Information analysis Pattern analysis Data mining Signal processing Fault diagnosis Signal representations Signal generators
Content Type	Text
Resource Type	Article
Subject	Computer Science Electrical and Electronic Engineering

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