NDLI: Surface micromachined accelerometers

Content Provider	IEEE Xplore Digital Library
Author	Boser, B.E. Howe, R.T.
Copyright Year	1966
Abstract	Surface micromachining has enabled the cofabrication of thin-film micromechanical structures and CMOS or bipolar/MOS integrated circuits. Using linear, single-axis accelerometers as a motivating example, this paper discusses the fundamental mechanical as well as the electronic noise floors for representative capacitive position-sensing interface circuits. Operation in vacuum lowers the Brownian noise of a polysilicon accelerometer to below 1 /spl mu/g//spl radic/(Hz). For improved sensor performance, the position of the microstructure should be controlled using electrostatic force-feedback. Both analog and digital closed-loop accelerometers are described and contrasted, with the latter using high-frequency voltage pulses to apply force quanta to the microstructure and achieve a very linear response.
Sponsorship	IEEE Solid-State Circuits Society IEEE Electron Devices Society IEEE Circuits and Systems Society Japan Society of Applied Physics (JSAP) IEEE Microwave Theory and Techniques Society IEEE San Francisco Section Bay Area Council Univ. PA IEEE
Starting Page	366
Ending Page	375
Page Count	10
File Size	1500628
File Format	PDF
ISSN	00189200
Volume Number	31
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Accelerometers Integrated circuit noise Microstructure Micromachining Thin film circuits Micromechanical devices MOS integrated circuits Mechanical sensors Force control Electrostatics
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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