NDLI: Modeling joining materials for microelectronics packaging

Content Provider	IEEE Xplore Digital Library
Author	Kivilahti, J.K.
Copyright Year	1994
Abstract	Modeling of solder-substrate interactions together with careful experimental work can provide a good basis for developing new materials such as conductive adhesives and Pb-free solders as well as fluxless soldering processes for microelectronics packaging. The modeling of the solder-substrate interactions will in effect lead to a rationalization of the trial and error methods commonly employed and hence minimize the number of experiments required. It provides useful information on the chemical reactions, stabilities of various microstructures and growth rates of reaction products during joining or in use of electronic devices. This is of particular importance in the case of small solder volumes, since the compositions and microstructures of solder alloys can be entirely altered by the solder-substrate reactions during the joining. As specific examples the solder-substrate reactions have been investigated in the Sn-Bi/Cu and Sn-Bi-Zn/Cu systems with and without adhesives. The solder-substrate-environment interactions under high purity reducing gases have been studied also with the meniscograph. The reduction of surface oxides, formation and the stability of the intermetallic layers, Cu/sub 3/Sn and Cu/sub 6/Sn/sub 5/, and the growth of brittle Bi layer in the microjoints due to the change of the composition of the solder filler was studied both theoretically and experimentally. Moreover, an explanation concerning the strong dewetting effect of zinc-containing solders found experimentally is given. An emphasis was placed also on the solder-substrate-environment interaction by studying the effect of humidity on chemical stability of microjoints in an epoxy-based adhesive.<>
Sponsorship	IEEE Computer Society
Starting Page	326
Ending Page	333
Page Count	8
File Size	877060
File Format	PDF
ISSN	10709894
Volume Number	18
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Joining materials Microelectronics Packaging Stability Lead Microstructure Tin Conducting materials Conductive adhesives Soldering
Content Type	Text
Resource Type	Article
Subject	Engineering

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