NDLI: Achieving accurate thermal characterization using a CFD code-case study of plastic packages

Content Provider	IEEE Xplore Digital Library
Author	Burgos, J. Manno, V.P. Azar, K.
Copyright Year	1994
Abstract	Achieving component-level thermal characterization using computational fluid dynamics (CFD) is assessed using a case study approach. A commercial CFD code (FLOTHERM) is used to simulate the thermal performance of three plastic-based microelectronic packages (68-lead and 84-lead plastic leaded chip carriers or PLCC's, and a 164-lead plastic quad flat pack or PQFP) under forced air cooling conditions. Predictions of junction-to-ambient thermal resistance (/spl theta//sub ja/) are compared to experimental measurements. One aspect of the work is to use results from a single situation (84-PLCC and an approach air velocity of 1.52 m/s) to develop a set of "modeling guidelines". These modeling guidelines are then applied to the other components (68-PLCC and 164-PQFP) and flow conditions (0.7-3.05 m/s) to test their validity. Guideline parameters include near component flow field nodalization, geometric detail in representing conduction paths and code user options such as turbulent flow models. The average deviation of predicted versus measured values of /spl theta//sub ja/ was 7.5% using the derived guidelines. An additional component design sensitivity investigated was the effect of the introduction of a heat spreading "heat post" in the high temperature regions of the 164-PQFP,.
Sponsorship	Ericsson IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	732
Ending Page	738
Page Count	7
File Size	857797
File Format	PDF
ISSN	10709886
Volume Number	18
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Computational fluid dynamics Guidelines Thermal resistance Computational modeling Thermal force Microelectronics Plastic packaging Electronics packaging Cooling Electrical resistance measurement
Content Type	Text
Resource Type	Article
Subject	Engineering

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