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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Khotanzad, A. Banerjee, H. Srinath, M.D. |
| Copyright Year | 1988 |
| Abstract | A critical stage in the manufacture of integrated circuit devices is inspection of the wire bonds which connect the chip to the lead fingers of the device. This paper describes a vision system for 1) automatic inspection of that part of the wire bond where the wire connects to the bond pad on the chip and 2) inspection of the 2-D profile of the bonding wire. A popular type of bonding (connection to bond pad) known as "ball bond" is considered here. Using two-dimensional images taken from the top of the IC wafer, the system determines several geometric measures which are important in determining the quality of the bond and the wire. These include the center and the boundary of the bond as well as the degree of straightness of the wire. A bond shape analysis based on the parameters of the best fitting ellipse to the bond is developed. The bonding process can be monitored through tracking the statistics of the bond shape measures. The system has been tested in a prototype manufacturing environment with excellent results.< |
| Sponsorship | IEEE Electron Devices Society IEEE Components, Packaging, and Manufacturing Technology Society IEEE Reliability Society IEEE Solid-State Circuits Society |
| Starting Page | 413 |
| Ending Page | 422 |
| Page Count | 10 |
| File Size | 1014033 |
| File Format | |
| ISSN | 08946507 |
| Volume Number | 7 |
| Issue Number | 4 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1994-11-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Machine vision Inspection Wire Wafer bonding Shape measurement Integrated circuit manufacture Fingers Semiconductor device measurement Fitting Bonding processes |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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