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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Johnson, R.R. |
| Copyright Year | 1963 |
| Abstract | Summary form only given. The state of the art was discussed in terms of costs, densities, speeds, sizes, yields, rework, testing methodologies, and thermal capabilities for the principle production interconnects. Comparisons were made for each of the newer MCM (multichip module) technologies for which data are available. Observations about costs, reworkability, assembly methods, yields, and testing were made to indicate the author's views on where and how costs for MCMs can be driven down to become competitive with existing interconnect systems.< |
| Sponsorship | IEEE Electron Devices Society |
| Starting Page | 2689 |
| File Size | 138950 |
| File Format | |
| ISSN | 00189383 |
| Volume Number | 38 |
| Issue Number | 12 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1991-12-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Multichip modules Liquid crystal displays Thin film transistors Dielectric substrates Wiring Costs Thermal management Active matrix technology Delay Silicon compounds |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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