NDLI: Scattering from composite materials: a first-order model

Content Provider	IEEE Xplore Digital Library
Author	Krohn, T.L. Medgyesi-Mitschang, L.N.
Copyright Year	1963
Abstract	The nonspecular electromagnetic scattering from finite composite laminates is investigated. The composite material is modeled as planar lamina composed of undirectional collimated fibers with regular spacings between the elements. The fibers, perfectly or partially conductive, are assumed to be embedded in a resin matrix translucent to electromagnetic radiation. For the partially conductive case, the Schelkunoff Ansatz is used. The case of two-plied laminates with skewed fiber orientation is discussed. The mathematical formulation is based on the electric-field integral equation solved with an entire-domain Galerkin expansion. Results are obtained for laminates with both finite and infinite numbers of elements. For the latter, the Floquet-Galerkin solution for periodic structures is used. The effect of truncation of the panels is discussed for arbitrary angles of illumination. It is shown that in many cases implementation of the Floquet-Galerkin solution using diagonal system matrices yields accurate results for the nonspecular cross sections of the laminates. The theoretical results are confirmed by experimental data.<>
Sponsorship	IEEE Antennas and Propagation Society
Starting Page	219
Ending Page	228
Page Count	10
File Size	654781
File Format	PDF
ISSN	0018926X
Volume Number	37
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1989-02-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Composite materials Laminates Electromagnetic scattering Transmission line matrix methods Collimators Resins Electromagnetic radiation Integral equations Periodic structures Lighting
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electrical and Electronic Engineering

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