NDLI: Controlled Electromigration for Field Failure Acceleration

Content Provider	IEEE Xplore Digital Library
Author	Juskey, F.
Copyright Year	1978
Abstract	The advent of SMT has caused a new concern for the electromigration failure mechanism. The new smaller electronic assemblies with higher density interconnections now are prime candidates for catastrophic field failures. Since the failure mechanism is so well-known and documented, it is possible to take advantage of these known responses to environmental, chemical, and physical properties and develop a procedure for testing components, boards, and entire assemblies. In order for electromigration to occur three things are necessary: ions, moisture, and an electric potential. Since removal of any one of these three necessary items will inhibit the process and prevent electromigration, a carefully controlled experiment Can be established to determine threshold values for each parameter. Once these threshold values are quantified, they can be used to predict the outcome of a device under test. A simple test for stressing specific areas of an assembly has been developed. This test can then be applied to a functional system or component and a life expectancy can be predicted. In this manner, incompatible components can be eliminated from the system or their surfaces prepared in such a manner as to prevent its premature demise. Some of the areas to which this type of testing is well-suited are printed circuit board platings, component platings, and final assembly cleaning. With this information the best possible process can be determined for coating the exposed metal surfaces so that maximum reliability is achieved.
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	370
Ending Page	373
Page Count	4
File Size	481478
File Format	PDF
ISSN	01486411
Volume Number	10
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1987-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromigration Acceleration Assembly Failure analysis Circuit testing Surface-mount technology Integrated circuit interconnections Chemicals Mechanical factors Moisture
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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