NDLI: A New Fully Additive Fabrication Process for Printed Wiring Boards

Content Provider	IEEE Xplore Digital Library
Author	Akahoshi, H. Murakami, K. Wajima, M. Kawakubo, S.
Copyright Year	1978
Abstract	A new fully additive manufacturing process for printed wiring boards is presented, and the performance of boards fabricated by this technology is evaluated. The attainment of satisfactory performance levels using this additive process is achieved by the development of a substrate and an accompanying metallization process having suitable properties. The new process uses commercially available unclad laminates as base materials and includes the following steps: 1) coating and curing of adhesive on the base laminate, 2) drilling of holes, 3) roughening and catalyzing of the adhesive surface, 4) printing negative circuit patterns by screen printing, and 5) formation of conductive circuits by full-build electroless copper plating. Reliability of the through hole interconnection was examined by thermal shock cycle tests. The peel strength between plated copper foils and substrate was measured before and after various heat treatments by soldering. The fully additive process makes it possible to fabricate reliable high-performance printed wiring boards with fewer processing steps than conventional subtractive processes.
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	181
Ending Page	187
Page Count	7
File Size	1026832
File Format	PDF
ISSN	01486411
Volume Number	9
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1986-06-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Wiring Additives Laminates Printing Circuits Copper Manufacturing processes Metallization Conducting materials
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Two novel additive processes to manufacture circuit boards: direct laser writing and direct electrostatic transfer and deposition

Thin Copper-Clad Laminates for Multi-Layer Printed Circuit Boards

The Tuf-Plate Hole for Printed Wiring

Elimination of Fractures in Plated-Through-Hole Printed Circuit Boards by the Use of Ductile Plating

Low dielectric material for multilayer printed wiring boards

Partly-additive process for manufacturing high-density printed wiring boards

Application of laser engraving for the fabrication of fine resolution printed wiring laminates for MCM-Ls

Evaluation of Aerosol, Superfine Inkjet, and Photolithography Printing Techniques for Metallization of Application Specific Printed Electronic Circuits

Cost and environmental metrics for a high density laminate technology

A New Fully Additive Fabrication Process for Printed Wiring Boards

Similar Documents

Two novel additive processes to manufacture circuit boards: direct laser writing and direct electrostatic transfer and deposition

Thin Copper-Clad Laminates for Multi-Layer Printed Circuit Boards

The Tuf-Plate Hole for Printed Wiring

Elimination of Fractures in Plated-Through-Hole Printed Circuit Boards by the Use of Ductile Plating

Low dielectric material for multilayer printed wiring boards

Partly-additive process for manufacturing high-density printed wiring boards

Application of laser engraving for the fabrication of fine resolution printed wiring laminates for MCM-Ls

Evaluation of Aerosol, Superfine Inkjet, and Photolithography Printing Techniques for Metallization of Application Specific Printed Electronic Circuits

Cost and environmental metrics for a high density laminate technology

A New Fully Additive Fabrication Process for Printed Wiring Boards