NDLI: A New Chip Carrier for High Performance Applications: Integrated Decoupling Capacitor Chip Carrier (IDCCC)

Content Provider	IEEE Xplore Digital Library
Author	Val, C. Martin, J.
Copyright Year	1978
Abstract	The impact of inductance has rarely been considered in semiconductor Packaging. This is the reason for using the capacitor in the first place: it is a small, local energy reservoir for those current transients which cannot go back to the power supply without causing unacceptahly large voltage drops (V = L di/dt). Since 1978 a new chip carrier with integrated deeoupling capacitor (IDCCC) has been studied. T]he capacitor is located inside the bottom layer in a threelayer or a single-layer chip-carrier. The ceramic package previous!y used had a nonactive bonding pad layer: with our IDCCC, this layer (standard thickness is 25 mils) is made out of several layers from 3 to 5 mils with the electrodes. The technology is about the same as the one used in multilayer ceramic capacitors. This capacitor is located just under the device, but not under the conductor I/O to avoid a parasitic capacitive coupling. With the coming of leadless and leaded full array chip carriers such as pin grid array, we applied the same concept with a Capacitor inside the cap. The results with different current-pulse signals show the effects of the capacitor's inductance, resistance, and capacitance. The main specifications of this new chip carrier will be presented. In addition to improving speed and electrical Performances, the IDCCC allows an increase in density and in reliability level.
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	290
Ending Page	297
Page Count	8
File Size	1159336
File Format	PDF
ISSN	01486411
Volume Number	6
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1983-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Capacitors Inductance Ceramics Semiconductor device packaging Reservoirs Power supplies Voltage Bonding Electrodes Nonhomogeneous media
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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