NDLI: Humidity Test of Premolded Chip Carriers

Content Provider	IEEE Xplore Digital Library
Author	Martin, J. Hanley, L.
Copyright Year	1978
Abstract	Premolded chip carrier packages made by AMPl containing test chips coated with various protective materials were humidity-tested at 85°C/85 percent relative humidity (RH) with a 40-V dc bias for 1000 h. The test chips were also packaged in plastic dual in-line packages (DIP's), and ceramic DIP's and tested at the same time for comparison. The purpose of this test was to gather preliminary information on the suitability of the premolded chip carrier as a semiconductor package. As expected none of those in the hermetic packages failed. The test chips in the chip carrier with protective coatings survived better than those in the plastic DIP's, and one of the chip carrier groups had no failures. The data are sufficiently encouraging to recommend continued development and testing of premolded packages.
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	210
Ending Page	213
Page Count	4
File Size	590245
File Format	PDF
ISSN	01486411
Volume Number	4
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1981-06-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Humidity Testing Plasma temperature Plastic packaging Semiconductor device packaging Coatings Protection Electric shock Silicon Aluminum
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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