NDLI: Encapsulated Toners in Xerography and their Shell Fracture Mechanics

Content Provider	IEEE Xplore Digital Library
Author	Harpavat, Ganesh L.
Copyright Year	1972
Abstract	The effect of various elastic and physical parameters on the strength of the shell in encapsulated toner is examined. The contact problem of a toner particle and a pressure roller is discussed, and the mechanism of shell fracture from the viewpoint of Hertz's impact theory is reviewed. The magnitudes of the impact force, the fracturing force, and the paper damaging stress are estimated. Within the framework of linear elasticity theory, general expressions for the stresses induced in the shell and core have been derived for both solid and liquid cores. Particular cases have been computed and presented in normalized graphical form on a unit loading basis. The shell strength depends strongly on the geometrical and elastic properties of the core and shell materials, specifically on the shell thickness, the ratio of the core and shell shear moduli, and the tensile strength of the shell material. The modes of toner fracture and the significant effects of the elastic properties of the paper on the crushing force of the particles is discussed. It is shown that the breaking of the particles is facilitated by a harder surfaced paper.
Sponsorship	IEEE Industry Applications Society
Starting Page	576
Ending Page	582
Page Count	7
File Size	3035850
File Format	PDF
ISSN	00939994
Volume Number	IA-16
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1980-07-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrophotography Stress Elasticity Solids Surface cracks Industry Applications Society Genetic expression Pressing Electrostatics Meeting planning
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering

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