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Microwave bonding of mems component
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 2005 |
| Description | Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy. |
| File Size | 339022 |
| Page Count | 7 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20080007011 |
| Archival Resource Key | ark:/13960/t4qk2cs3b |
| Language | English |
| Publisher Date | 2005-06-14 |
| Access Restriction | Open |
| Subject Keyword | Solid-state Physics Microelectromechanical Systems Patents Bonding Microwaves Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Patent |