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Tough, processable simultaneous semi-interpenetrating polyimides (Document No: 20080005972)
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1996 |
| Description | A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process. |
| File Size | 836974 |
| Page Count | 14 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20080005972 |
| Archival Resource Key | ark:/13960/t5w71d77h |
| Language | English |
| Publisher Date | 1996-02-20 |
| Access Restriction | Open |
| Subject Keyword | Nonmetallic Materials Mechanical Properties Patents High Temperature Tolerances Mechanics Polyimides Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Patent |
