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Nickel cobalt phosphorous low stress electroplating
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 2002 |
| Description | An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least about 2% to 25% by atomic volume of phosphorous. The process solutions contains nickel and optionally cobalt sulfate, hypophosphorous acid or a salt thereof, boric acid or a salt thereof, a monodentate organic acid or a salt thereof, and a multidentate organic acid or a salt thereof. The pH of the plating bath is from about 3.0 to about 4.5. An electroplating process is also provided which includes electroplating from the bath a nickel or nickel cobalt phosphorous alloy. This process can achieve a deposit with high microyield of at least about 84 kg/mm.sup.2 (120 ksi) and a density lower than pure nickel of about 8.0 gm/cc. This process can be used to plate a deposit of essentially zero stress at plating temperatures from ambient to 70.degree. C. |
| File Size | 1157013 |
| Page Count | 13 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20080004990 |
| Archival Resource Key | ark:/13960/t6d26w69x |
| Language | English |
| Publisher Date | 2002-06-18 |
| Access Restriction | Open |
| Subject Keyword | Mechanical Engineering Patents Nickel Alloys Atoms Plating Electrodeposition Nickel Electroplating Cobalt Cobalt Alloys Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Patent |
