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Physically separating printed circuit boards with a resilient, conductive contact
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1999 |
| Description | A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board. |
| File Size | 588861 |
| Page Count | 8 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20080004460 |
| Archival Resource Key | ark:/13960/t9f52m895 |
| Language | English |
| Publisher Date | 1999-12-07 |
| Access Restriction | Open |
| Subject Keyword | Electronics And Electrical Engineering Electric Conductors Circuit Boards Patents Printed Circuits Electronic Packaging Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Patent |