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Electronic packaging techniques
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1979 |
| Description | A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs. |
| File Size | 188115 |
| Page Count | 1 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20070019713 |
| Archival Resource Key | ark:/13960/t9m37mv44 |
| Language | English |
| Publisher Date | 1979-02-01 |
| Access Restriction | Open |
| Subject Keyword | Technology Utilization And Surface Transportation Connectors Systems Engineering Printed Circuits Electronic Packaging Cost Reduction Aerospace Systems Production Costs Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
