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Apparatus and method for cold welding thin wafers to hard substrates (Document No: 19960017160)
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1995 |
| Description | An apparatus for coating and bonding parts in a vacuum that includes a floating mount assembly holding one part and applying a bonding load to the parts is discussed. A pivoting mount assembly holds one part and is pivoted between a coating position and a bonding position. At least one coating source is provided for depositing a thin film of a metal onto a surface of each of the parts to improve the cold weld between the two parts. A restraining lever controls the application of the bonding load to the parts. The coating and bonding process occurs in a vacuum chamber with a single set-up. |
| File Size | 996376 |
| Page Count | 26 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19960017160 |
| Archival Resource Key | ark:/13960/t55f3rc0c |
| Language | English |
| Publisher Date | 1995-02-16 |
| Access Restriction | Open |
| Subject Keyword | Mechanical Engineering Thin Films Metal Films Metal Surfaces Cold Welding Patent Applications Wafers Bonded Joints Coating Bonding Vacuum Effects Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Patent |
