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Automated inspection of solder joints for surface mount technology
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Savage, Robert M. Park, Hyun Soo Fan, Mark S. |
| Copyright Year | 1993 |
| Description | Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints. |
| File Size | 3060598 |
| Page Count | 38 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19930016948 |
| Archival Resource Key | ark:/13960/t3518xd03 |
| Language | English |
| Publisher Date | 1993-03-01 |
| Access Restriction | Open |
| Subject Keyword | Radiography Nondestructive Tests Solders X Rays Supports Infrared Inspection Inspection Imaging Techniques Automatic Control Laser Applications Defects Ultrasonics Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
