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Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Ishizaka, A. Iwata, S. Yamamoto, H. |
| Copyright Year | 1984 |
| Description | The influence of Al surface condition on the thermocompression bonding of Au wires to Al electrodes for integrated electric circuits was studied. Au wires were connected to Al electrodes by nail-head bonding after various Al surface treatments. Bonding was evaluated by measuring the wire pull strength and fraction of the number of failures at Au-Al bonds to the total number of failures. Dependence of the fraction on applied load was derived theoretically with a parameter named critical load to take into consideration the differences in Al surface condition. The relation also held explicately for various surface treatments. Characterization of the Al surface was carried out by electron microscopy for chemical analysis. |
| File Size | 2932809 |
| Page Count | 26 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19850003819 |
| Archival Resource Key | ark:/13960/t7mp9w195 |
| Language | English |
| Publisher Date | 1984-10-01 |
| Access Restriction | Open |
| Subject Keyword | Metallic Materials Gold Compressing Aluminum Shear Strength Electron Microscopy Wire Surface Finishing Load Tests Electrodes Integrated Circuits Breaking Oxide Films Metal-metal Bonding Aluminum Oxides Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
