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Phenoxy resins containing pendent ethynyl groups
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Hergenrother, P. M. Jensen, B. J. Havens, S. J. |
| Copyright Year | 1984 |
| Description | As part of an effort on tougher/solvent resistant matrix resins for composites, research was directed towards exploring methods to improve the solvent resistance of linear amorphous thermoplastics. Ethyl reactive groups were placed on the ends of oligomers and pendent along the polymer chain and subsequently thermally reacted to provide crosslinking and thus improvement in solvent resistance. This concept is extended to another thermoplastic, a phenoxy resin. A commercially available phenoxy resin (PKHH) was systematically modified by reaction of the pendent hydroxyl groups on the phenoxy resin with various amounts of 4-ethynylbenzoyl chloride. As the pendent ethynyl group content in the phenoxy resin increased, the cured resin exhibited a higher glass transition temperature, better solvent resistance and less flexibility. The solvent resistance was further improved by correcting a low molecular weight diethynyl compound, 2,2-bis(4-ethynylbenzoyloxy-4'-phenyl)propane, with a phenoxy resin containing pendent ethynyl groups. |
| File Size | 539958 |
| Page Count | 22 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19840008270 |
| Archival Resource Key | ark:/13960/t2b903k0d |
| Language | English |
| Publisher Date | 1984-01-01 |
| Access Restriction | Open |
| Subject Keyword | Nonmetallic Materials Solvents Thermoplastic Resins Composite Materials Polymeric Films Glass Transition Temperature Molecular Weight Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
