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A review of high-temperature adhesives
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | St clair, A. K. St clair, T. L. |
| Copyright Year | 1981 |
| Description | The development of high temperature adhesives and polyphenylquinoxalines (PPQ) is reported. Thermoplastic polyimides and linear PPQ adhesive are shown to have potential for bonding both metals and composite structures. A nadic terminated addition polyimide adhesive, LARC-13, and an acetylene terminated phenylquinoxaline (ATPQ) were developed. Both of the addition type adhesives are shown to be more readily processable than linear materials but less thermooxidatively stable and more brittle. It is found that the addition type adhesives are able to perform, at elevated temperatures up to 595 C where linear systems fail thermoplastically. |
| File Size | 1097124 |
| Page Count | 21 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19810018740 |
| Archival Resource Key | ark:/13960/t1fj78v4q |
| Language | English |
| Publisher Date | 1981-07-01 |
| Access Restriction | Open |
| Subject Keyword | Nonmetallic Materials Thermoplastic Resins Polymer Chemistry Adhesives Tolerances Mechanics Linearity Polyimides Mechanical Properties Polyquinoxalines Metal-metal Bonding High Temperature Polyimide Resins Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
