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Array automated assembly, phase 2
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Taylor, W. E. |
| Copyright Year | 1978 |
| Description | An analysis was made of cost tradeoffs for shaping modified square wafers from cylindrical crystals. Tests were conducted of the effectiveness of texture etching for removal of surface damage on sawed wafers. A single step texturing etch appeared adequate for removal of surface damage on wafers cut with multiple blade reciprocating slurry saws. |
| File Size | 3096154 |
| Page Count | 66 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19780016707 |
| Archival Resource Key | ark:/13960/t6wx2653r |
| Language | English |
| Publisher Date | 1978-02-01 |
| Access Restriction | Open |
| Subject Keyword | Energy Production And Conversion Solar Arrays Photovoltaic Cells Wafers Low Cost Tradeoffs Silicon Etching Cost Analysis Protective Coatings Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |