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Recommended practices for encapsulating high voltage assemblies
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Tankisley, E. W. |
| Copyright Year | 1974 |
| Description | Preparation and encapsulation of high voltage assemblies are considered. Related problems in encapsulating are brought out in these instructions. A test sampling of four frequently used encapsulating compounds is shown in table form. The purpose of this table is to give a general idea of the working time available and the size of the container required for mixing and de-aerating. |
| File Size | 675441 |
| Page Count | 15 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19740026535 |
| Archival Resource Key | ark:/13960/t6wx25c31 |
| Language | English |
| Publisher Date | 1974-08-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Equipment Electronic Packaging Production Engineering Encapsulating High Voltages Assemblies Potting Compounds Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Article |