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Evaluation of nondestructive tensile testing (Document No: 19720005270)
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Bowe, J. J. Polcari, S. M. |
| Copyright Year | 1971 |
| Description | The results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds are presented. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations. |
| File Size | 2110582 |
| Page Count | 51 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19720005270 |
| Archival Resource Key | ark:/13960/t44r2nh8x |
| Language | English |
| Publisher Date | 1971-05-01 |
| Access Restriction | Open |
| Subject Keyword | Structural Mechanics Nondestructive Tests Semiconductor Devices Life Durability Weld Tests Tensile Tests Mechanical Properties Static Loads Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
