NDLI: INORGANIC-ORGANIC HYBRID ENCAPSULATION OF FLEXIBLE CU(IN, GA)SE2 MINI-MODULES

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INORGANIC-ORGANIC HYBRID ENCAPSULATION OF FLEXIBLE CU(IN, GA)SE2 MINI-MODULES

Content Provider	Hyper Articles en Ligne (HAL)
Author	Zhang, Shan-Ting Salomon, Oliver Wuerz, Roland Harnisch, Martina Zimmermann, Andreas Kessler, Friedrich Hildebrandt, Thibaud Schneider, Nathanaelle
Copyright Year	2020
Abstract	An effective encapsulation solution is required to achieve market entry for flexible Cu(In,Ga)Se2 (CIGS) technology. In this work, we demonstrate the concept of inorganic-organic hybrid encapsulation by encapsulating 3×10 cm² CIGS/polyimide mini-modules with 25 nm Al2O3 barrier layer grown by atomic layer deposition (ALD) in combination with back and front sheets. All mini-modules were encapsulated with a back sheet from Lenzing Plastics, while two different commercial front sheets from Feron and 3M were tested. When exposed to damp heat test, due to the presence of front encapsulation (ALD-Al2O3 and front sheet), the moisture ingress is slowed down during the first 150 h, but progressively penetrates into modules upon increasing exposure time, degrading mainly Isc. The moisture ingress imposes stringent requirements in front encapsulation of flexible CIGS/polyimide mini-modules. Studies in employing thicker ALD-Al2O3 barrier layers and/or better H2O-resistant front sheets will be carried out in the future.
Related Links	https://hal.science/hal-03448084/file/Schneider%20et%20al.%20-%202020%20-%20Inorganic-Organic%20Hybrid%20Encapsulation%20of%20Flexible.pdf
ISSN	00016002
Journal	Acta Médica Costarricense
Language	English
Publisher	HAL CCSD Colegio de Médicos y Cirujanos de Costa Rica
Publisher Date	2020-01-01
Access Restriction	Open
Subject Keyword	Flexible Substrate Encapsulation Stability Degradation CIGS
Content Type	Text
Resource Type	Article

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