NDLI: Copolymerization of Parylene C and Parylene F to Enhance Adhesion and Thermal Stability without Coating Performance Degradation.

Please wait, while we are loading the content...

Copolymerization of Parylene C and Parylene F to Enhance Adhesion and Thermal Stability without Coating Performance Degradation.

Content Provider	Europe PMC
Author	Xu, Han Yang, Zhou Guo, Yechang Xu, Qingmei Dou, Songtao Zhang, Pan Jin, Yufeng Kang, Jiajie Wang, Wei
Editor	Dmitrenko, Mariia E. Penkova, Anastasia V. Zou, Lusi
Copyright Year	2023
Abstract	Parylene C has been widely used in the fields of microelectromechanical systems (MEMS) and electronic device encapsulation because of its unique properties, such as biocompatibility and conformal coverage. However, its poor adhesion and low thermal stability limit its use in a wider range of applications. This study proposes a novel method for improving the thermal stability and enhancing the adhesion between Parylene and Si by copolymerizing Parylene C with Parylene F. The successful preparation of Parylene copolymer films containing different ratios of Parylene C and Parylene F was confirmed using Fourier-transform infrared spectroscopy and surface energy calculations. The proposed method resulted in the copolymer film having an adhesion 10.4 times stronger than that of the Parylene C homopolymer film. Furthermore, the friction coefficients and cell culture capability of the Parylene copolymer films were tested. The results indicated no degradation compared with the Parylene C homopolymer film. This copolymerization method significantly expands the applications of Parylene materials.
Journal	Polymers
Volume Number	15
PubMed Central reference number	PMC10007139
Issue Number	5
PubMed reference number	36904490
e-ISSN	20734360
DOI	10.3390/polym15051249
Language	English
Publisher	MDPI
Publisher Date	2023-02-28
Access Restriction	Open
Rights License	Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). © 2023 by the authors.
Subject Keyword	Parylene copolymerization adhesion enhancement thermal stability coating performance
Content Type	Text
Resource Type	Article
Subject	Chemistry Polymers and Plastics

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in