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| Content Provider | Directory of Open Access Journals (DOAJ) |
|---|---|
| Author | Tianhua Li Hongbo Hu |
| Abstract | This paper adopts the improved liquid-phase chemical deoxidization to prepare nano-copper powder used as principal conducting material instead of nano-silver particles in conductive ink of printed electronics. The prepared nano copper particles are analyzed for their microstructure and electrical conductivity. Studies show that the prepared nano-copper particles are mainly distributed chain-like, with an average particle size of 26 nm, of which, those with 20-25nm amount to 42%, 25-30nm to 29%. The PVP surfactant can effectively organize the oxidation of nano-copper. After the sintering temperature exceeds 412°C, the organic materials mixed in the nano-copper have completely volatilized. The content of nano copper decomposition product hits upon 46.5% of the original sample. The higher the sintering temperature, the lower the sheet resistance of the conductive copper film. After the sintering temperature exceeds the melting point of nano-copper, a stable conductivity channel will be formed on the surface of the film. Subsequently, continuous sintering of the film has an insignificant effect on its conductivity. |
| e-ISSN | 22839216 |
| DOI | 10.3303/CET1866006 |
| Journal | Chemical Engineering Transactions |
| Volume Number | 66 |
| Language | English |
| Publisher | AIDIC Servizi S.r.l. |
| Publisher Date | 2018-01-01 |
| Publisher Place | Italy |
| Access Restriction | Open |
| Subject Keyword | Chemical Engineering Computer Engineering. Computer Hardware |
| Content Type | Text |
| Resource Type | Article |
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