NDLI: Leaching of lead from solder material used in electrical and electronic equipment

Content Provider	CSIR - National Metallurgical Laboratory (NML)
Author	Choubey, Pankaj K. Kumari, Archana Kumar, Rakesh Lee, Jae-chun Jha, Manis K. Kumar, Vinay
Abstract	Present work is a part of developing novel recycling tec-hnique for waste printed circuit boards (PCBs) i.e. the liberation of metals from PCBs by organic swelling follow-ed by the treatment of resin to remove/ recover hazardous soldering materials. In order to recover the hazardous metallic constituent lead from the liberated resin, initially the leaching studies were made using fresh solder containing 63.9% Pb and remaining tin. Experimental results obtained in different conditions viz. time,temperature and acidity showed ~97.20% of lead dissolution with 6M HNO3 at solid to liquid (S:L) ratio 1:10 (g/mL) and temperature 90oC in 75 minutes. The result of the studies validated with crushed PCBs shows that almost total lead and tin was leached out with 6M HNO3 and 6M HCl respectively at S:L ratio 1:10 (g/mL) and temperature 90oC within 50 minutes. The results will be useful for the treatment and safe disposal of PCBs resin.
Starting Page	25
Ending Page	31
File Format	PDF
Conference Proceedings	Proceedings of second symposium on Recycling of waste II on 2011 at Recycling of waste II
Language	English
Publisher	CSIR-National Metallurgical Laboratory
Publisher Date	2011-01-01
Access Restriction	Open
Subject Keyword	Lead Metal Extraction & Forming Waste Management Metallurgy Leaching
Content Type	Text
Resource Type	Article

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Leaching of lead from solder material used in electrical and electronic equipment