Loading...
Please wait, while we are loading the content...
Similar Documents
Advanced RF/Baseband Interconnect Schemes for Inter- and Intra-ULSI Communications
| Content Provider | CiteSeerX |
|---|---|
| Author | Chang, Mau-Chung Frank Verbauwhede, Ingrid Chien, Charles Xu, Zhiwei Kim, Jongsun Ko, Jenwei Gu, Qun Lai, Bo-Cheng |
| Abstract | Abstract—Future inter- and intra-ULSI interconnect systems demand extremely high data rates (up to 100 Gbps/pin or 20-Tbps aggregate) as well as bidirectional multiI/O concurrent service, re-configurable computing/processing architecture, and total compatibility with mainstream silicon system-on-chip and system-in-package technologies. In this paper, we review recent advances in interconnect schemes that promise to meet all of the above system requirements. Unlike traditional wired interconnects based solely on time-division multiple access for data transmission, these new interconnect schemes facilitate the use of additional multiple access techniques including code-division multiple access and frequency-division multiple access to greatly increase bandwidth and channel concurrency as well as to reduce channel latency. The physical transmission line is no longer limited to a direct-coupled metal wire. Rather, it can be accomplished via either wired or wireless mediums through capacitor couplers that reduce the baseband noise and dc power consumption while simplifying the fabrication process by eliminating vertical metal studs needed in three-dimensional ICs. These new advances in interconnect schemes would fundamentally alter the paradigm of ULSI data communications and enable the design of next-generation computing/processing systems. Index Terms—3-D IC interconnect, CDMA DRAM, CDMA-interconnect (CDMA-I), FDMA-interconnect (FDMA-I), FDMA DRAM, inter/intra-ULSI communications, multilevel signal clock data recovery, multicarrier DCMA-Interconnect (MCCDMA-I), realtime re-configurable interconnects, RF-interconnect (RF-I), re-configurable interconnect for next-generation systems (RINGS), simultaneous and bidirectional multiI/O service. I. |
| File Format | |
| Access Restriction | Open |
| Subject Keyword | Intra-ulsi Communication Advanced Rf Baseband Interconnect Scheme Interconnect Scheme Three-dimensional Ic Dc Power Consumption Bidirectional Multii Service Total Compatibility Baseband Noise High Data Rate Channel Concurrency Additional Multiple Access Technique Intra-ulsi Interconnect System Demand System-in-package Technology 20-tbps Aggregate Bidirectional Multii Concurrent Service Vertical Metal Stud Wireless Medium New Interconnect Scheme Abstract Future Inter Re-configurable Interconnect Code-division Multiple Access Mainstream Silicon System-on-chip Cdma Dram Ulsi Data Communication Physical Transmission Line Frequency-division Multiple Access Channel Latency Gbps Pin Recent Advance System Requirement Fabrication Process Index Term 3-d Ic Interconnect Inter Intra-ulsi Communication Multilevel Signal Clock Data Recovery Direct-coupled Metal Wire Processing Architecture Time-division Multiple Access Data Transmission Traditional Wired Interconnects Capacitor Coupler New Advance Fdma Dram Next-generation System Realtime Re-configurable Interconnects |
| Content Type | Text |
