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Reliability and yield: a joint defectoriented approach (2004)
| Content Provider | CiteSeerX |
|---|---|
| Author | Barsky, Roman Wagner, Israel A. |
| Description | We present a model for computing the probability of a parametric failure due to a spot defect. The analysis is based on electromigration in conductors under unidirectional current stress. Analytical solution is given for simple layout and simulations for a more complicated case. Then we show that in some cases electromigration-dependent parametric defects can make a significant contribution to the total yield estimation. 1 |
| File Format | |
| Language | English |
| Publisher Date | 2004-01-01 |
| Publisher Institution | Proceedings of the 19th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems |
| Access Restriction | Open |
| Subject Keyword | Spot Defect Unidirectional Current Stress Analytical Solution Parametric Failure Total Yield Estimation Significant Contribution Case Electromigration-dependent Parametric Defect Complicated Case Simple Layout |
| Content Type | Text |
| Resource Type | Article |
