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Hybrid modules as an alternative to paralleled discrete devices.
| Content Provider | CiteSeerX |
|---|---|
| Author | Farruggia, Robin L. Morozowich, Donald K. |
| Abstract | Mosfets are currently being used in an increasing number of applications, especially battery powered and high frequency systems. In many of these systems several chips must be paralleled to achieve the necessary performance. The chips can either be paralleled as discrete plastic packages, or as chips within a hybrid module. Hybrid modules have the advantage over paralleled discrete devices when more than 5 chips in parallel are required to develop a design. In this type of system the hybrid module will be the smallest, electrically isolating the module will be easiest, thermal management will be the best, and the total system cost will be the lowest. Paralleled discrete devices have the advantage over hybrid modules when only 2 or 3 chips in parallel are required to develop a design. In this type of a system, discrete devices paralleled on a PCB provide the smallest footprint. Also electrical isolation and parasitic inductance are usually not difficult to manage in this size system. Several applications, and their implementations as parallel discrete devices on a PCB and as hybrid modules, are discussed and used to illustrate the tradeoffs between solutions. |
| File Format | |
| Access Restriction | Open |
| Subject Keyword | Hybrid Module Paralleled Discrete Device Discrete Device Parallel Discrete Device Several Application Total System Cost Thermal Management Discrete Plastic Package Necessary Performance System Several Chip Size System Parasitic Inductance High Frequency System Electrical Isolation |
| Content Type | Text |
