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Implementation of lead-free reflow soldering process – the quality issues.
| Content Provider | CiteSeerX |
|---|---|
| Author | Koziol, Grazyna Bukat, Krystyna Gromek, Jozef |
| Abstract | Abstract: According to the EU RoHS Directive many electronic manufactures have had to introduce lead-free materials in soldering processes in July 2006. The implementation of lead-free pastes, PCB surface finishes and termination of components can generate a big impact on the mounting process and potentially on solder joints quality. Mainly it is caused by differences in a melting temperature, wetting characteristics and self-centering capability of lead-free alloy in comparison to tin lead materials. Some surface mount defects can arise especially for assembly of different types and sizes components also miniature one onto the PC board. From 1999, ITR has assisted Polish companies in transition to environmental friendly technologies of PCB production and mounting technologies. In the paper the results of investigation on lead-free technologies carried out during the UE projects: PRINT, GreenRoSE as well as national projects are presented. |
| File Format | |
| Access Restriction | Open |
| Subject Keyword | Lead-free Reflow Soldering Process Quality Issue Environmental Friendly Technology Self-centering Capability Mounting Process Lead-free Paste Polish Company Surface Mount Defect Lead-free Technology Big Impact Lead-free Material Lead Material Lead-free Alloy Ue Project National Project Pcb Production Pc Board Solder Joint Quality Pcb Surface Finish Melting Temperature |
| Content Type | Text |
| Resource Type | Article |
