Sos3: three-step optimization of pre-bond tsv test for 3d stacked ics.

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Abstract	Abstract — Based on a recent pre-bond TSV probing technique, this paper first proposes an iterative greedy procedure to sort the order of test sessions for reducing pre-bond TSV test time. We then combine the session sorting procedure with two existing methods and propose a 3-Step test time Optimization Simulator named “SOS3”. SOS3 consists of 3 steps, namely, an ILP (integer linear programming) model for session generation, a greedy procedure for session sorting, and a TSV identification algorithm for early test termination. Experiments are done for various TSV networks and two observations are summarized. First, session sorting plays an important role within SOS3 as it helps further reduce pre-bond test time expectation and thus reduces pre-bond TSV test cost. Second, SOS3 as a framework greatly speeds up the pre-bond TSV test. I.
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