NDLI: Development of an Axisymmetric Pressure Application Method for Cylindrical Laminated Device Fabrication

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	James, H. Vlieg Brian, K. Paul Richard, B. Peterson
Copyright Year	2010
Abstract	Microchannel arrays are being developed across a wide spectrum of applications including blood processing, fuel cells and thermal management among many others. Typical arrays are based on a flat laminated architecture produced in a vacuum hot press (VHP) through uniaxial bonding pressure at elevated temperatures. Due to the cylindrical nature of certain microchannel applications, such as chemical processing within chemical facilities and heat rejection within Stirling cycle engines, the packaging of microchannel devices within cylindrical geometries would greatly simplify interconnect. This paper describes the development of a novel technique for axisymmetric diffusion bonding pressure application with the use of a VHP capable of producing cylindrical laminated devices. Uniaxial bonding pressure is converted to axisymmetric pressure through the use of conical wedges. Pressure magnitude and distribution are controlled by the geometry of the pressure delivery platens, the design of which was aided by finite element analysis. Cylindrical test articles were produced by patterning thin metal foils by laser machining a single roll of metal shim stock, which was then coiled within an outer tube shell and axisymmetrically bonded with the VHP to produce a cylindrical laminated workpiece. Preliminary bonding results show quality bond lines with minimal void fractions. This new architecture is shown to be feasible for producing cylindrical laminated devices by microlamination using traditional VHP equipment.
Sponsorship	Manufacturing Engineering Division
Starting Page	355
Ending Page	362
Page Count	8
File Format	PDF
ISBN	9780791849477
DOI	10.1115/MSEC2010-34227
e-ISBN	9780791838877
Volume Number	ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2
Conference Proceedings	ASME 2010 International Manufacturing Science and Engineering Conference
Language	English
Publisher Date	2010-10-12
Publisher Place	Erie, Pennsylvania, USA
Access Restriction	Subscribed
Subject Keyword	Cycles Temperature Metals Machining Shells Diffusion bonding (metals) Wedges Pressure Blood Engines Microchannels Design Geometry Heat Vacuum Lasers Fuel cells Packaging Thermal management Manufacturing Finite element analysis Metal foil Bonding
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in