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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Oprins, Herman Cherman, Vladimir Plas, Geert Van Der Vos, Joeri De Beyne, Eric |
| Copyright Year | 2015 |
| Abstract | In this paper, we present the experimental characterization of 3D packages using a dedicated stackable test chip. An advanced CMOS test chip with programmable power distribution has been designed, fabricated, stacked and packaged in molded and bare die 3D packages. The packages have been experimentally characterized in test sockets with and without cooling, and soldered to the PCB. Using uniform and localized hot spot power distribution, the thermal self-heating and thermal coupling resistance and the lateral spreading in the 3D packages have been studied. Furthermore, the measurements have been used to characterize the thermal properties of the epoxy mold compound and the die-die interface and to calibrate a thermal model for the calculation of equivalent properties of underfilled μbump arrays. This model has been applied to study the trade-off between the stand-off height reduction and the underfill thermal conductivity increase in order to reduce the inter die thermal resistance. |
| Sponsorship | Electronic and Photonic Packaging Division |
| File Format | |
| ISBN | 9780791856888 |
| DOI | 10.1115/IPACK2015-48316 |
| Volume Number | Volume 1: Thermal Management |
| Conference Proceedings | ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels |
| Language | English |
| Publisher Date | 2015-07-06 |
| Publisher Place | San Francisco, California, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Epoxy adhesives Thermal properties Cooling Thermal resistance Heating Epoxy resins Tradeoffs Experimental characterization Thermal conductivity Heat transfer Complementary metal oxide semiconductors |
| Content Type | Text |
| Resource Type | Article |
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